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| GP1S36J0000F GP1S36J0000F Phototransistor Output, Transmissive Photointerrupter with Tilt Direction (3-direction) Detecting Description GP1S36J0000F is a compact-package, phototransistor output, transmissive photointerrupter, with opposing emitter and detector in a molding that provides noncontact sensing. This is a 2-phase output device, suitable for detection of the position (3 direction). Agency approvals/Compliance 1. Compliant with RoHS directive Applications 1. General purpose detection of device direction. 2. Example : Camera, DSC, Camcorder, Robot Features 1. Transmissive with phototransistor output 2. Highlights : * Built-in a ball (2 phase output) * Compact * PWB mounting type * 3-direction detection 3. Lead free and RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D3-A05501EN Date Oct. 3. 2005 (c) SHARP Corporation GP1S36J0000F Internal Connection Diagram Top view 3 2 1 PT2 4 2 3 4 5 PT1 5 1 Anode Cathode Emitter 2 Emitter 1 Collector Outline Dimensions Top view (Unit : mm) 4.2 Sharp mark "S" 4 3.0MIN. 3.8 Date code 0.4 *1.27 *1.27 0.15+0.2 -0.1 *3.05 5 4 3 2 1 * Unspecified tolerance : 0.2mm * The dimensions indicated by refer to those measured from the lead base. * Burr is not included in the dimensions. Burr's dimensions : 0.15MAX. Product mass : approx. 0.1g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D3-A05501EN 2 GP1S36J0000F Date code (2 digit) 1st digit Year of production A.D. Mark 2000 0 2001 1 2002 2 2003 3 2004 4 2005 5 2006 6 2007 7 2008 8 2009 9 2010 0 : : 2nd digit Month of production Month Mark 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 10 X 11 Y 12 Z repeats in a 10 year cycle Country of origin Japan, China Sheet No.: D3-A05501EN 3 GP1S36J0000F Absolute Maximum Ratings Parameter Forward current Reverse voltage Power dissipation Collector-emitter voltage Symbol Rating IF 50 VR 6 P 75 VCE1O 35 VCE2O VE1CO 6 VE2CO 20 IC 75 PC 100 Ptot Topr -25 to +85 Tstg -40 to +100 Tsol 260 Tsol 320 Input (Ta=25C) Unit mA V mW V V mA mW mW C C C C Output Emitter-collector voltage Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature 1 Soldering temperature 1 2 Soldering temperature 2 1mmMIN. Soldering area 1 For MAX. 5 s (Soldering area is shown below) 2 For MAX. 2 s (Eachterriral shall be hand-soldered at more 0.8mm for from bottom of resin package) Electro-optical Characteristics Input 3 Output Transfer characteristics 3 Parameter Symbol Forward voltage VF Reverse current IR Dark current ICEO Collector current IC 4 Leak current ILEAK Collector-emitter saturation voltage VCE(sat) Rise time tr Response time Fall time tf Condition IF=20mA VR=3V VCE=20V VCE=5V, IF=5mA VCE=5V, IF=5mA IF=10mA, IC=60A VCE=5V, IC=100A, RL=1k MIN. - - - 60 - - - - TYP. 1.2 - - - - - 50 50 (Ta=25C) MAX. Unit 1.4 V 10 A 100 nA 350 A 15 A 0.4 V 150 s 150 s 3 Output and coupling characteristics are common to the both phototransistors. 4 Characteristics except leak current is measured at =0, =0. Leak current is the output current of transistor when =90, =0 and IC=OFF. Sheet No.: D3-A05501EN 4 GP1S36J0000F Absolute Maximum Ratings -90 -75 IC1 IC2 OFF ON Indefinite -15 +15 (IF=5mA, VCC=5V, 5) +75 +90 Indefinite OFF ON IC1 : Output current of phototransistors PT1 IC2 : Output current of phototransistors PT2 : Device condition : Refer to the next figure : Device condition : Refer to the next figure ON :Output current of phototransistors : 60A or more OFF : Output current of phototransistors : 15A or less Output of ON/OFF is under the condition that the device is in stationary state. Device state diagram - + - + PT Side Gravity direction Gravity direction Supplement Detecting slit Resin cover case Space Detecting slit <90 rotated> Resin mold package Ball(=1.2mm, material : iron) Principle of Tilt Detection (Viewing from detecting side) PT1 PT2 Gravity direction PT2 PT1 PT1 output PT2 output Indefinite Indefinite (ON) (OFF) (ON) (ON) (OFF) (ON) Indefinite Indefinite PT : Detected PT : Undetected PT : Indefinite Sheet No.: D3-A05501EN 5 GP1S36J0000F Fig.1 Forward Current vs. Ambient Temperature 60 50 Fig.2 Power Dissipation vs. Ambient Temperature 120 100 Power dissipation P (mW) 80 75 60 40 20 0 -25 Ptot Forward current IF (mA) 40 30 20 10 0 -25 P, PC 0 25 50 75 85 100 0 25 50 75 85 100 Ambient temperature Ta (C) Ambient temperature Ta (C) Fig.3 Forward Current vs. Forward Voltage Fig.4 Collector Current vs. Forward Current 2.2 2 1.8 Collector current IC (mA) 1.6 1.4 1.2 1 0.8 0.6 0.4 Ta=25C VCE=5V Ta=75C 50C Forward current IF (mA) 100 25C 0C -25C 10 1 0 0.5 1 1.5 2 2.5 3 3.5 Forward voltage VF (V) 0.2 0 0 5 10 15 20 25 30 35 40 45 50 Forward current IF (mA) Fig.5 Collector Current vs. Collector-emitter Voltage 2.2 2 1.8 Collector current IC (mA) 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 1 2 3 4 IF=10mA IF=5mA 5 6 7 8 9 10 IF=20mA IF=30mA Ta=25C IF=50mA Fig.6 Relative Collector Current vs. Ambient Temperature 120 110 100 Relative collector current (%) 90 80 70 60 50 40 30 20 10 0 -25 IF=5mA VCE=5V IC=100% at Ta=25C 0 25 50 75 Ambient temperature Ta (C) Sheet No.: D3-A05501EN IF=40mA Collector-emitter Voltage VCE (V) 6 GP1S36J0000F Fig.7 Collector-emitter Saturation Voltage vs. Ambient Temperature Collector-emitter saturation voltage VCE(sat) (V) 0.2 0.18 0.16 0.14 0.12 0.1 0.08 0.06 0.04 -25 0 25 50 75 85 IF=10mA IC=60A Fig.8 Response Time vs. Load Resistance 1 000 VCE=5V IC=100A Ta=25C Response time tr, tf, td, ts (s) tr 100 td 10 tf ts 1 0.1 0.1 1 10 100 Ambient temperature Ta (C) Load resistance RL (k) Fig.9 Collector Dark Current vs. Ambient Temperature 10-6 VCE=20V Fig.10 Test Circuit for Response Time VCC Input RD RL Output Output 10% 90% Input Collector dark current ICEO (A) 10-7 10-8 td tr ts tf 10-9 10-10 0 25 50 75 100 Ambient temperature Ta (C) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D3-A05501EN 7 GP1S36J0000F Design Considerations Design guide 1) Prevention of malfunction To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. Please confirm that there is no mis-operation by magnetic field in use, for prevention of mis-operation by magnetic field. Please dont let the device put in change of temperature that makes dew for prevention of mis-operation by dew. If the device is put in the change of temperature which makes dew, please leave the device for enough time in the constant temperature for use. This product is not designed against irradiation and incorporates non-coherent IRED. Degradation In general, the emission of the IRED used in photointerrupter will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Parts This product is assembled using the below parts. * Photodetector (qty. : 1) Category Phototransistor Material Silicon (Si) Maximum Sensitivity wavelength (nm) 800 Sensitivity wavelength (nm) 700 to 1 200 Response time (s) 12 * Photo emitter (qty. : 1) Category Infrared emitting diode (non-coherent) Material Gallium arsenide (GaAs) Maximum light emitting wavelength (nm) 950 I/O Frequency (MHz) 0.3 * Material Case Black polyphenylene sulfide resin (UL94 V-0) Lead frame 42Alloy Lead frame plating SnCu plating Packing case Polycarbonate Metal ball Fe Sheet No.: D3-A05501EN 8 GP1S36J0000F Manufacturing Guidelines Soldering Method Flow Soldering: Soldering should be completed below 260C and within 5 s. Please solder within one time. Soldering area is 1mm or more away from the bottom of housing. Please take care not to let any external force exert on lead pins. Please don't do soldering with preheating, and please don't do soldering by reflow. Hand soldering Hand soldering should be completed within 2 s when the point of solder iron is below 320C. Soldering area is 0.8mm or more away from the bottom of housing. Please solder within one time. Soldered product shall treat at normal temperature. Lead pin Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solderability with actual conditions and confirm. And the uniformity in color for the lead terminals are not specified. Other notice Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Cleaning instructions The device shall not be washed with washing material, for there is possibility to remain washing material in internal space of this transmissive type photointerrupter. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D3-A05501EN 9 GP1S36J0000F Package specification Sleeve package Package materials Sleeve : Polystyrene Stopper : Styrene-Butadiene Package method MAX. 40 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. MAX. 50 sleeves in one case. Sheet No.: D3-A05501EN 10 GP1S36J0000F Important Notices * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [H180] Sheet No.: D3-A05501EN 11 |
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